Deep X-ray lithography system with a uniform and high-accuracy fabrication area established in beamline BL11 at NewSUBARU

A new lithography system to fabricate high-aspect-ratio 3D microstructures was developed at the NewSUBARU synchrotron radiation facility (University of Hyogo, Japan). The X-ray beam generated by this system has high parallelism (horizontal and vertical divergence angles of 278   µ rad and 14   µ rad, respectively) and high photon flux (31   mW   mm − 2 at a beam current of 300   mA). The high photon flux and exposure area of the system were validated and a beam-scan method for a large exposure area with a uniform dose distribution has been proposed. In addition, the deep X-ray lithography performance was characterized using a conventional photosensitive material and the synchrotron-radiation-induced direct etching of polytetrafluoroethylene (PTFE) was demonstrated. An enlargement of the microfabrication area up to 100   mm × 100   mm while contemporarily ensuring high uniformity was achieved.
Source: Journal of Synchrotron Radiation - Category: Physics Authors: Tags: deep X-ray lithography microfabrication LIGA process beamlines Source Type: research