[ASAP] Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States

ACS Applied Materials& InterfacesDOI: 10.1021/acsami.3c00978

Source: ACS Applied Materials and Interfaces - July 5, 2023 Category: Materials Science Authors: Naiqi Chen, Kunming Yang, Ziyang Wang, Boan Zhong, Jingjing Wang, Jian Song, Quan Li, Jiamiao Ni, Fangyuan Sun, Yue Liu, and Tongxiang Fan Source Type: research