[ASAP] A Critical Review of Thermal Boundary Conductance across Wide and Ultrawide Bandgap Semiconductor Interfaces

ACS Applied Materials& InterfacesDOI: 10.1021/acsami.3c02507

Source: ACS Applied Materials and Interfaces - June 16, 2023 Category: Materials Science Authors: Tianli Feng, Hao Zhou, Zhe Cheng, Leighann Sarah Larkin, and Mahesh R. Neupane Source Type: research