[ASAP] Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and Beyond

ACS Applied Materials& InterfacesDOI: 10.1021/acsami.1c02912

Source: ACS Applied Materials and Interfaces - April 14, 2021 Category: Materials Science Authors: Yiwen Song, Carlos Perez, Giovanni Esteves, James Spencer Lundh, Christopher B. Saltonstall, Thomas E. Beechem, Jung In Yang, Kevin Ferri, Joseph E. Brown, Zichen Tang, Jon-Paul Maria, David W. Snyder, Roy H. Olsson III, Benjamin A. Griffin, Susan E. Trol Source Type: research