Mechanical strength problem of thin silicon wafers (120 and 140 μm) cut with thinner diamond wires (Si kerf 120 → 100 μm) for photovoltaic use

Publication date: 15 November 2020Source: Materials Science in Semiconductor Processing, Volume 119Author(s): Halubai Sekhar, Tetsuo Fukuda, Katsuto Tanahashi, Hidetaka Takato, Hiromichi Ono, Yoshiyuki Sampei, Tsubasa Kobayashi
Source: Materials Science in Semiconductor Processing - Category: Materials Science Source Type: research