[ASAP] 3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage

ACS NanoDOI: 10.1021/acsnano.9b02362

Source: ACS Nano - October 28, 2019 Category: Nanotechnology Authors: Mansik Jo †‡, Seunghwan Bae†#, Injong Oh§, Ji-hun Jeong§, Byungsoo Kang†?, Seok Joon Hwang†?, Seung S. Lee§, Hae Jung Son†¶, Byung-Moo Moon‡, Min Jae Ko*?, and Phillip Lee*†? Source Type: research