Rudolph Receives First Order for its StepFAST Solution for Fan-out Panel-level Packaging

Order includes a repeat JetStep System sale as OSAT moves to HVM Wilmington, Mass. (May 9, 2019)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph’s exclusive StepFAST™ Solution for panel-level packaging production, which includes a repeat order for the JetStep® panel lithography system. Rudolph’s StepFAST Solution is a feed-forward adaptive shot technology that addresses...This story is related to the following:X-Ray Lithography Equipment

Source: Industrial Newsroom - Health, Medical and Dental Supplies - May 10, 2019 Category: Medical Devices Source Type: news