Multislice imaging of integrated circuits by precession X-ray ptychography.

In this study, tilt-series ptychographic diffraction data sets of a two-layered circuit with a ∼1.4 µm gap at nine incident angles are collected in a wide Q range and then artifact-reduced phase images of each layer are successfully reconstructed at ∼10 nm resolution. The present method has great potential for the three-dimensional observation of flat specimens with thickness on the order of 100 µm, such as three-dimensional stacked integrated circuits based on through-silicon vias, without laborious sample preparation. PMID: 29269599 [PubMed - in process]
Source: Adv Data - Category: Epidemiology Authors: Tags: Acta Crystallogr A Found Adv Source Type: research